The Conductonaut Extreme liquid metal thermal compound is the further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the minimum possible layer thickness.
Conductonaut Extreme thermal paste is technically not a thermal paste, as a paste consists of liquid and solid particles. The disadvantage of a paste is the solid particles. The surfaces of the base plate of the CPU cooler and the CPU heat spreader are uneven on a microscopic level. A traditional thermal paste fills these irregularities unevenly. Since the solid particles are larger than the gaps caused by the unevenness, more distance must be filled between the cooler and the heat spreader.
A heat-conducting medium in the form of liquid metal does not have this problem because it does not contain any "large" particles. As a result, the surfaces of the CPU cooler and heat spreader are closer together. At the same time, liquid metal has a constant heat transfer, while the larger solid particles in pastes usually conduct heat better than the paste parts. Liquid metal is preferable to thermal paste, especially in high energy applications.